Qualcomm Snapdragon 895 to Ditch Samsung, Use TSMC Cores to Fix Overheating in Snapdragon 888

Friday, June 4, 2021

Qualcomm Snapdragon 895 to Ditch Samsung, Use TSMC Cores to Fix Overheating in Snapdragon 888

Posted By: June 04, 2021 Leave a Reply
The Qualcomm Snapdragon 895 has been teased to feature 4nm Kryo 780 cores, a Snapdragon X65 5G modem, Adreno 730 GPU and more.

from Top Tech News- News18.com https://ift.tt/3wXRFRc

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